Improvement Of The Fabrication Process For4-inch Silicon Microchannel Plate And The Investigation Of Its Application For Electron Multiplier

Silicon microchannel structure has been explored intensively for numerous possible applications, such as Microchannel Plate, micro heat exchanging device,3-D lithium ion battery and micro chemical reactor etc.This paper has two parts, in the first parts, we investigate the fabrication process of the macroporous silicon, including n type and p type. We mainly focus on the mechanism and method for gaining the separated silicon microchannel plate, and we have successfully fabricated the good-structure separated silicon microchannel plate by optimizing the lumination system and improving the Lab VIEW codes.Silicon microchannel plate is a new kind of electron multiplier proposed in the late1990s, Which is based on the semiconductor process technique. Compared with the traditional glass dynode, Silicon microchannel plate makes it possible for selecting the substrate material and the dynode material respectively, and at the same time separates the pore array fabrication process and the continuous dynode manufacture craft. Therefore the silicon microchannel continuous dynode has many choices of material.This paper has mainly studied the continuous dynode material emission characteristic, investigated the semiconductor process of fabricating the dynode of silicon microchannel plate. Growing a thin polysilicon film as the conducting layer by PECVD or LPCVD, through the rapid thermal annealing (RTP) to form a ultrathin SiO2film as the secondary electron emission layer, combining the theoretical calculation with the experiment result, we find the main reason is that the resistivity of the polysilicon is too low.The last chapter, is the summarization of this paper and the prospect of silicon microchannel plate in the future.