Novel Polishing Pad Application In CMP Process

In21st century，it’s the key to succeed for enterprise with high technology, ample resourceand continuous innovation. However，resource will reduce with poor cost control.Meanwhile, production efficiency will decrease as well. Especially in FAB industry, thefact is that production equipment is extremely costly and the production process is verycomplex. Thus，developing advanced production process and good cost control willimprove the competitive strength and the chance of survival for FAB factory.Being a new process，CMP plays a crucial role in FAB production. However，With thecritical dimension turns smaller and smaller, the integration turns higher and higher, CMPencounters more and more challenge.From the practical problem of baseline polish pad, a kind of new pad (Low Slurry Flowrate pad) is introduced. This pad features long lifetime, low slurry flow rate and highproduction efficiency. Firstly, the paper describes design principle and process character.Secondly, we deeply researched many key parameters which impact CMP process,explored the best known method. Lastly, we verified the feasibility of new pad on themonitor wafer and mass production.The experiment result is that we can obtain10%more of remove rate,30%more oflifetime and16%more of slurry usage under the condition of slurry flow rate85ml/minand slurry nozzle offsetting3.8inches from polishing platen center. The application of thiskind of pad will increase the wafer productivity and reduce the yearly cost26%less.The new LSF pad is suitable for mass production after a long-term effective productverification process.