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General Cpu In The Application Of High Speed Circuit

Posted on:2013-10-24Degree:MasterType:Thesis
Country:ChinaCandidate:B ZhuFull Text:PDF
GTID:2248330395950299Subject:Electronics and Communications Engineering
Abstract/Summary:PDF Full Text Request
With the continuous improvement in data capacity requirements, digital signal transmission speed is also rising to meet the development of the times. Signal and power integrity issues become increasingly prominent, and brought a lot of challenges to the hardware design. Especially in the high-speed interconnect computer systems, how to be secure, stable and efficient operation of the operating system has people pondering the problem. How to apply Intel’s latest generation by civil CPU——Ivy Bridge in high-speed circuit is discussed in this thesis.First and foremost, it reviews the origin and development of early computers.Then, the basic theory of transmission lines based on high-density PCB is detailed in the second chapter. It’s discusseed the basis of the premise in the thesis. The characteristic impedance of signal lines in low and high frequency of expressions are derivated in this chapter. And it summarizes the types of signal lines and the advantages and disadvantages of commonly used transmission line characteristic impedance formula. In addition to derive the high-speed signal of the reflection coefficient formula on how to conduct the signal integrity of the termination and termination type. With a brief description of the load effect of the high-speed signal, load-driven approach and loss of the transmission line are concluded at the end of the chapter.In the third chapter, it introduces the architecture design in Chief River platform at first, and summarizes the types of bus involved in the contrast design. Then, from the perspective of signal design elaborate high-speed parallel and serial transmission point of view to describe the design and the theory of DDR3and PCI-E bus. To adjust the USB2.0/3.0signal eye diagrams to illustrate the significance of the PCB design by instances. Simultaneously, to summary the signal traces in the PCB layout which to be adhered to the wiring rules.In the fourth chapter, much detailed description and comparison on two kinds of the DC-DC conversion. To verify their respective advantages, disadvantages, and use by experiments. Then, reflecting the power management to the importance of practical use through the CPU and device power state diagrams and the case of the system startup sequence. Meanwhile, further evidence of the actual case is shown in system cooling.Last but by no means least, Intel’s next generation platform by Shark Bay will commence a brief description. Moreover, it outlines the design direction for next-generation platform. Make predictions on the future development of the computer.
Keywords/Search Tags:high-speed interconnect design, signal integrity, transmission Line, parallel, serial, general-purpose CPU, High-speed circuit
PDF Full Text Request
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