High-speed Interconnect Technology Based On Substrate Integrated Coaxial Line

As the rapid development of digital communication,chips process and transmit date more and more quickly.Signals are gradually developing towards ultra-high frequency especially millimeter-wave band,which puts forward higher requirements on loss,crosstalk,bandwidth and other signal integrity performance of interconnects.Nowadays the performance of interconnects has become a bottleneck affecting the integration and transmission speed of systems.Therefore it is urgently needed to develop new high-speed interconnects.In this dissertation,the interconnect technology based on substrate integrated coaxial line?SICL?is investigated,with the purpose of designing and implementing interconnects with high bandwidth,low loss and high speed.The main work is as follows:Firstly,a kind of SICL with a conductor-backed coplanar waveguide?CBCPW?transition is designed and then implemented.A design method for SICL is summarized.As for the CBCPW transition,different designs are investigated with HFSS simulation,and then an optimal transition is selected.The influence of the numbers of the vertical metallic vias on performance is researched by simulation,and the most proper case is determined.The whole CBCPW-SICL-CBCPW transmission line is fabricated with low temperature cofired ceramics?LTCC?technology.It is verified by experimental results that its bandwidth is up to 40 GHz and the date rate could reach 32 Gbps,with a bit error rate less than 10^-12,which indicates good performance.Secondly,a new kind of double-L-shaped SICL is proposed,and it is realized with LTCC technology.This structure has advantages of high speed,low crosstalk and so on.Characteristics of the corner in double-L-shaped SICL are simulated and analyzed in detail,and then an optimized design is determined.The experimental results show that this structure has an excellent performance with data rate of 60 Gbps,and the coupling is below-40 dB.In addition,comparison among the double-L-shaped SICL,a double-L-shaped micro strip line?MSL?and a double-L-shaped strip line?SL?is made with HFSS simulation.Simulation results show that the double-L-shaped SICL has outstanding advantage on insertion loss,return loss and coupling.Lastly,a 15-channel SICL array and a double-layered-40-channel SICL array are proposed and realized.Experimental results show that they could realize ultra-high speed data transmission.