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Reasearch On Examination Of High-density Circuit Assembly And Optimization Of Assembly Technology

Posted on:2012-05-31Degree:MasterType:Thesis
Country:ChinaCandidate:C Y LiuFull Text:PDF
GTID:2248330395455393Subject:Computer application technology
Abstract/Summary:PDF Full Text Request
The micro-encapsulation and multi-tiered of the circuit technology promote the replacement of traditional circuit by high-density circuit gradually, the traditional repeatedly assembly technology can not meet the requirements in presision and efficiency. So, it becomes an urgent problem to solve that the assembly should be examined by computer. Meanwhile, the multi-tiered of the high-density circuit make the assembly sequence optimization more complex and more restrict. Optimizing the components assembly sequence of the high-density circuit can shorten the assembly time and improve the assembly efficiency.This paper researches the features and assembly technology of the high-density ciurcuit, and analyzes the development process, evaluation methods and the factors that affect the assembly efficiency of the assembly. The assembly rules are summaried, classified and digitaled to provide data structure for further examination. Meanwhile, this paper constructs geometric model for components and circuit board, executes investigation for the high-density circuit. Besides, based on the analysis of the multi-tiered characteristics of high-density circuits, the problem of nozzle selection and allocation are solved by adopting clustering thougth, and the ant colony algorithm with clustering is improved to applied to the assembly sequence optimization of the components, which solves the problem of low efficiency of assembly.It can be seen from the experiments that the assembly investigation for the high-density circuit enable reflect the problems in the assembly process fastly, accurately and comprehensively, optimizating of path of the assembly of high-density circuit by improved ant colony algorithm with clustering can solve the problem which caused by the multi-tiered of the high-density circuit and can improve the assembly efficiency significantly.Since there are a variety type of mount machine, which structure changing constantly, this paper researches the general mount machine, in the further research, the optimization algorthm shouled be improved or adjusted to adapte the sepcial mount machine.
Keywords/Search Tags:High-density Circuit, Design for Assembly, Auto Examination, Clustering Processing Ant Colony Algorithm, Assembly Sequence, Optimization
PDF Full Text Request
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