Embedded System Platform For Thermal Analysis And Optimization Design

This paper is based on an embedded system design background, this system, like otherembedded systems, integrated circuits and components, as well as high-speed electroniccircuits such as system failure due to the complexity of the working environment of thesystem, so many reasonsHowever, overheating or thermal defects are one of the causes of thefailure. Therefore, to study the effects of thermal design has an extremely importantsignificance to improve the reliability of modern electronic products and to accelerate thelow-carbon development of human life.First, this article is based on heat transfer theory, to analyze the reasons causing thetemperature rise in the system, the establishment of a mathematical model of the PCB and thePCB using infinitesimal body heat balance method to determine the temperature distributionnode components in the layout of the circuit board design. Analysis of the two main types ofradiation interference in the PCB board: heat radiation and heat conduction coupling, and thesuppression of thermal failure measures.Secondly, detailed study of the thermal analysis of the components of electroniccomponents on the PCB board, and thus more accurate and fast thermal analysis method toevaluate the thermal characteristics of embedded systems and the impact on the thermalperformance of the PCB, PCB board the thermal design provides a reliable foundation.Wherein, in the design of the hardware platforms, mainly in the design of peripheral circuitsmainly, because of the heat radiation and heat conduction coupling is the main heat source ofinterference in the peripheral circuit design, therefore, appropriate in the components of thePCB layout design process consider reducing the number of active device circuits on thesubstrate, to optimize the distribution of the temperature field of the PCB board.Flotherm simulation software used in the design simulation modeling of the PCB, andthe use of the Fluck infrared thermometer to make a good board thermal testing, and test the thermal design of the PCB by Smart View3.0software, given all the data of the temperaturefield, which a more reliable experimental results and design guidance on the design ofelectronic products to lay a compacted base, in order to obtain better thermal performance ofelectronic products.