Research On Thermal Analysis And Thermal Optimization Of Embedded Computer System

The trend of electronic equipments' development has led to sharp problems of their temperature. Rather so is electronic equipments based on embedded system. Their working temperature exceeds the rated temperature limit or their thermal defect is one of causes which made electronic equipments disabled, this badly restricts the increase in their reliability. So, the continually increase in electronic equipments' working temperature is a problem which must to be solved.A lot of domestic and foreign literatures with regard to thermal analysis, thermal design and techniques of thermal testing are collected in this paper, they are studied by the numbers. The conceptions and techniques of thermal analysis, thermal design and thermal testing are expounded. Some commercial soft wares in electronic equipments' thermal analysis are investigated. At present, due to condition's restriction, thermal analysis, design and test of PCB level are only studied and some experiments are done. In order to describe the temperature distribution with mathematics, basic theories of heat transfer are introduced. Basic ways and principles of heat transfer are studied. The process of heat transfer is described with way of thermal resistance. Regarding thermal conduction in two-dimension as emphasis, analytical solution and numerical solution of thermal conduction's process are studyed, especially the numerical solution is detailedly represented.The essence of the idea of artificial ACA and the process of its implement are introduced in order to employ ant colony algorithm (ACA) to optimal placement of the electronic components in printed circuit board (PCB). In this paper, ant system, ant system with elitist strategy, ant colony system and max-min ant system are represented respectively, an improved ant colony algorithm are presented. Other global optimization theory of combinations, for examples, genetic algorithm and stimulating-anneal algorithm are compared with the ACA.In succession, the mathematic model of thermal conduction and the improved ant colony algorithm are concretely applied to thermal analysis of PCB level. The placements of electronic components in PCB are optimized in two-dimension place and three-dimension place respectively, the numerical values of the temperature field after initial placement and that after optimized placemen are analyzed. The steady temperature fields of the components in PCB before and after optimization are simulated and analyzed with the thermal analysis software Flotherm, they are compared...