The Experimental Research On Thermal Control Technology Of Electronics Under Hot Environment

Along with the high frequency, high speed development of electronics and the progressof the integrated circuit technology and micro e1ecttonical mechanical system(MEMS), thesize of electronic devices and the volume of the products are smaller and smaller and the heatflux density around the integrated device is bigger and bigger, which leads to the failure rateof electronic equipment. Therefore, the efficient thermal control technology, which guaranteesthe electronic components to play a good performance, has become a research hot spot.In this paper, the optimum thermal control scheme is determined by adopting thermalcontrol technology of the single and combination, This scheme makes the externaltemperature of electronic equipment under300℃for25min and the internal temperature lessthan or equal to60℃. The sum of weight is less than2kg. Firstly, theoretical calculation todifferent thickness of silica aerogel fiber is made by using a single thermal protectiontechnology. The results of theoretical calculation can guide the experiment to choose thethickness of thermal insulation layer. Then the experimental studies of different thickness ofsilica aerogel insulation fiber mat and fiberboard are made. When the thickness of silicaaerogel fiber board is20mm, the internal temperature can meet the experimentalrequirements. However, in order to avoid the failure of single heat control methods whichmakes the electronic equipment can’t work normally, the thermal protection and phase changetemperature control technology are used to continue optimizing experiment.The composite thermal control technology of thermal protection and phase changethermostat can prevent the external heat flow inside through thermal radiation and conductionby using the silica airgel fibreboard. And the paraffin phase change material is adopted as theinternal devices, which will absorb heat to ensure the stable operation of the electronic devicewhen the temperature rises to a certain temperature. The required amount of46#paraffin with15mm fiberboard is calculated in the hear transfer process of paraffin phase change material, which is a reference to decide the amount of paraffin in experiment. After analyzing theexperimental results of46#and36#paraffin alone based on their different arrangement andcombinations with15mm fiberboard, the optimum composite control scheme is determined.The best scheme is the composite thermal control method of two kinds of paraffin cross-typearrangement with15mm silica insulation fiberboard(1、3boxes have46#paraffin40g and2、4boxes have36#paraffin80g), which can make the internal temperature of the electronicdevice be controlled at39℃and the operation of electronic equipment safe, reliable andstable under prescribed conditions.