Study On The Process Of Dicing To The GaAs Materials

Dicing saw slice and divide semiconductor device by diamond blade’s high speed grinding. Semiconductor material silicon and ceramic are all hard and brittle material, because of their speciality and strict width limit of dicing street of semiconductor device, the wafer dicing process is very important in semiconductor device manufacturing. To improve the utilizing rate of material, Semiconductor manufacturing industry strictly limit the width of dicing street. For hard and brittle material, it is easy to crack the edges of street and damage the components when dicing To utilize material effectively and improve yield, the width of dicing street and edge crack must be minimized. The factors which could influence dicing efficiency and quality are performance of material, performance of equipment, blade and dicing process. The papers studies the dicing theory and process of semiconductor dicing, via analyzing the above factors, and optimizing parameters of dicing process.The paper analyzes characteristics of silicon and ceramic material, and studies air bearing spindle speed, dicing speed, dicing depth, coolant method and volume of flow, describes detail the main factors which influence dicing street and lead edge cracks.Adopting Taguchi methodology, via orthogonal experiment, to quantitatively research factors which could be controlled, and analyze factors which could not be controlled by orthogonal chart. Alter processing experiment datum, we get optimized process parameters, and complete experiment, Study shows the width of dicing street and sizes of edge cracks are decided by spindle speed, dicing speed, dicing depth, blade coolant flow volume and coolant method. A higher spindle speed could lead to a slower dicing speed, a wider dicing street and a smaller edge cracks. A shallow dicing depth and suitable coolant flow volume could get a better dicing effect. The precision of the end face of the flange decide directly the dicing quality, a optimized blade flange mechanism would help decrease width of dicing street and edge cracks.After a system study, the paper proposes optimum process parameters suitable for ceramic and silicon, and improvement methods for equipment. The paper’s study could help improve material utilizing rate and yield of semiconductor, raise performance and efficiency of equipment, having guiding function in actual production, Study provide a theory basis for researching semiconductor dicing and dicing saw.