Chemical Mechanical Polishing And Cleaning Technique Of Silicon Microchannel Array

Micro-channel plate is a semiconductor device with porous structure, and it has a wide range of application such as micro-channel, micro total analysis systems, micro heat transfer devices and micro-chemical equipment. However, silicon micro-channel has better improvement of gain and image resolution than tranditional glass fiber micro-channel plate. With the development, electrochemical etching what has the advantages of high aspect ratio and low cost has been widely uesd in process of silicon micro-channels plate.So, the processing and cleaning of the flat technology has flourished after the electrochemical etching of silicon micro-channel. This paper analyse the PH of slurry, pressure, the flux of slurry and the speed of table spin bring the effects to silicon micro-channel plate flatness; in addition, we have studied on remove the introductive impurities after the polishing, and make a detailed analysis of the temperature, the frequency of ultrasonic cleaning machine, cleaning time, cleanliness for the silicon micro-channel.By analyzing the impact,make sure clean flat silicon micro-channel plate of the important parameters. This paper analysis the influence of the effects in micro-channel plate chemical mechanical polishing cleaning technology after the study of related articles.