| With the rapid development of electronic Technology, information electronic Technology industries climbed era of the high-tech industry pioneer, electronic assembly Technology is information Technology industry development of the electronic core component of, and electronic assembly's Technology is the most important part of the circuit board Surface is stickup Technology (Surface Mounted Technology, SMT). SMT is currently in the field of electronic assembly one of the most popular technology and process, it is directly in the Circuit boards of solder paste Printed on the Surface paste components (Surface Mount Devices, SMD), and then after reflow soldering (Re-flow) heated to a definite temperature, then cooling way to cure electronic parts in Printed Circuit Board (PCB, Printed Circuit Board), and its features are high reliability, ant-vibration ability, solder defects low, high frequency characteristics, but also can reduce the electromagnetic and radio frequency interference etc. Characteristics. General use of the surface paste technology, electronic product size decreased by 40% to 60%, and the weight 60% to 80%. The surface of the circuit board the technology progress made paste electronic products began to miniaturization, high speed, multi-function direction of development, the development trend of the original work is generation enterprise to bring the unprecedented challenges, electronic assembly technology in progress, and now enterprise have SMT equipment was still in the original technical level, the automation technology has outpaced the paste modern product characteristics demand, this need to find a new way to make up for the lack of original equipment, then can make the enterprise have profit and survive.Information technology industry is our country electronic most promising industries, the country in the policy and financing all give information electronic technology industry various support, printed circuit board and surface paste technology closely related, because must have printed circuit board as the carrier, the surface paste to get sufficient play technology, printed circuit board with frivolous, short, precision, fast production as the guidance, it not only used in industrial equipment machine, and daily life in many electronic products need to use printed circuit board. Such as the most popular consumer electronics, 7 inch LCD digital photo frame will use printed circuit boards, bare base board (not a paste of electronic components called PCB substrate naked on a printing paste, and then in the surface of various electronic components on paste, through the reflow soldering fixed down, according to the requirements of the designer will electronic components serial or parallel to realize its established function, so as to make circuit board more powerful more suitable for the demand of the market, so the circuit board in the electronic products is widely applied.In the circuit board chip components application is very much, the package sizes from the original 1.27 mm pins center distance to today's 0.4 mm to 0.5 mm of center distance pins, and recently appeared BGA, CSP and naked chip (naked chip is refers to the semiconductor components manufacturing complete, encapsulation of product form before, is usually wafer form or single chip exists in the form of a semiconductor devices, shipped, integrated circuit, or more complex part of the circuit), from the perspective of the trend of development of electronic, BGA, CSP and naked chips will become the mainstream of the market. In order to reduce the volume of electronic parts and reduce the weight of electronic parts, electronic parts has begun to light miniaturization direction, and the integrated circuit (IC), the diversification of semiconductor applications has been put on the agenda, and traditional THT perforation technology can't catch the progress of science and technology, to be replaced by the more advanced surface paste technology, the application of these techniques changed our life.In the surface paste technology in the process of the assembly process, paste process is the key of the procedure, the surface paste technology that stick machine SMT equipment is also one of the most expensive equipment, paste the efficiency of the parts directly determine the efficiency and the whole assembly line of the efficiency of system, usually a surface paste technology line need different number of equipments composition, generally contains the following equipment: high speed placement machine, medium-speed stick machine piece, domestic machine, reflow soldering (the paste equipment), wave soldering (the paste equipment) and other components, high speed machine is mainly responsible for chip capacitor and resistor component paste; Medium speed machine and domestic machine is mainly responsible for the big chip paste, each a paste machine moved. Production line SMT placement equipment per the Cycle Time CT (Cycle Time, CT) almost equal arrangement, the balance of production rate and efficiency is the best. Which influence efficiency has two factors: (1) balance rate problem, balance and rate of production per machine components of SMT equipment parts whether there is a great relationship between the distribution of balance, that is, each machine of the components of the paste paste machine time is very close to a relationship, the closer the balance the higher rate. (2) efficiency, efficiency and the single machine SMT machine speed, paste paste stick efficiency and equipment on the standing corn move rate, how to improve the efficiency and dynamic rate stickup corn is the project need of discussion.In order to cater to the market for electronic products high quality, high standard, low cost requirements, enterprise USES automation paste mode batch production, companies choose SMT automation equipment complete automation components of the paste production mode can not only guarantees the quality and ensure the production efficiency at high levels. Therefore, in the modern manufacturing enterprise in SMT application to play an important role, but the production of high quality electronic products with high precision but need SMT equipment, general domestic equipment can not reach the precision requirement, I mainly by domestic import solution, the introduction of advanced equipment would also bring the advanced group technology, since the equivalent to the advanced overseas technology to complete production, equipment ductility is constrained.In 2011, the company received the client's new product M02 (M02 for product model, 7 inches of liquid crystal display (LCD digital photo frames) digital photo frames patch and assembling orders, M02 digital photo frames the circuit boards of size far beyond the company now has the Panasonic (Panasonic) SMT equipment paste range, want to successfully get orders must overcome the existing equipment patch limits, need to solve the contradiction of SMT equipment technology and physics contradictions. The existing SMT equipment paste M02 products efficiency is about 80%, according to the efficiency to batch production, the company almost no profit to speak, M02 products on the market before the close already announced outs, this undoubtedly is the sort of design department full, must rely on the improved to get play the day after tomorrow. The company top attached great importance to the efficiency of the new product M02, have set up special project team to improve research.According to the existing SMT equipment capability analysis, Panasonic SMT equipment to complete the mass, high efficiency production, because SMT machine of digital sensors paste (sensor) to identify the limit of the circuit board is far less than that of M02 digital photo frames double spell the actual length of the circuit board, which means there are parts of the circuit board paste machine can't paste in position. The company now use the equipment from the 70 s is the most advanced SMT paste machine, but with the development of technology of this equipment has left behind, the old SMT equipment paste ability and limit the scope of product diversification, the novelty of the design concept was born, in the shackles of the optimization of the innovation of the urgent need to break the deadlock, let original advanced high-tech automation equipment resurgent, discusses the optimization of the surface paste technology may improve efficiency, and has an important significance to the reality.Based on our new products M02 digital photo frames circuit board paste parts meet the efficiency as the research object, and ensuring the quality of the surface paste parts premise, explore new ways to improve efficiency to improve the efficiency of the production. In this study using gathers intelligence (TRIZ) invention and innovation methods are thinking, and bold ideas to improve, using innovative thinking to the above two analysis company in SMT placement machine surface paste technical aspects of the limitations and try to take measures to improve. In the process of project implementation, the failure of the many times experience teaching and the summary, finally make a breakthrough, find SMT equipment hardware and software of the matching point, fundamentally solve the company paste machine in M02 digital photo frames circuit boards paste parts exist in the physical and technical contradiction, the production efficiency and daily production capacity of the given a promotion, this to the company created a huge economic benefits. Practice the pure Panasonic and hybrid production line gathers intelligence (TRIZ) segmentation method of optimization is successful paste, broaden the company SMT paste machine paste limit, for the follow-up of other projects to improve provides a reference method. |
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