.0.13 Micron Copper Interconnect Process Dispatching System To Control The Waiting Time And Reduce Defects

The development of integrated circuit requires the continuous improvement of integration density and device speed,and it depends on the device miniaturization.With the scaling down,the transistor speed is getting much faster,however,the time delay from parasitic capacitance and resistance of the interconnects increases.When the IC reaches 0.13um technology node,the technology of Cu interconnects associated with low-k material become to replace the Al interconnects.But Cu has the disadvantage that it is easily to be oxidized and diffused.In Fact many of defects are enhanced by queue time before process.It is a problem how to improve self-capability to meet customer's rigorous requirements,which must be solved for FAB.We developed a set of dispatching system for meet customer's on time delivery.In order to reduce the defects which are induced by queue time,we improve functions to control queue time.Therefore,this dissertation is aimed to study the connection between the queue time and Cu defect.For example Crystal and Cu corrosion.We defined the standard queue time by experiment and setup dispatch rule to make sure the queue time under control.The dispating system which we developed has been implemented in Cu line & 12 inch FABs of SMIC...