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Keyword [Cu interconnect]
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1. Investigation Of Seedless Copper Plating On Novel Diffusion Barrier Materials For Cu Interconnect
2. The Study On The Reliability And Failure Mechanism Of Copper Interconnection In VDSM
3. Ic Cu Interconnect Process Of Ta-based Diffusion Barrier Layer Research
4. Ic Copper Interconnect Technology, Advanced Diffusion Barrier Layer
5. A Novel Intergrated Circuit Cu Interconnect Process Research
6. Density Functional Theory Study Of Copper Agglomeration On Transition Metal Nitride Surface
7. A New Generation Of Integrated Circuits Cu Interconnect Ta-based Diffusion Barrier Preparation And Characterization
8. Copper Interconnect In The Pvd Ta / Tan Barrier Layer Performance Improvements And Defect Control Study
9. .0.13 Micron Copper Interconnect Process Dispatching System To Control The Waiting Time And Reduce Defects
10. 0.13-micron CMOS Logic Process And On-chip Integrated Passive Device Development
11. Investigation Of Iniregrating Cu Film With Oxide Ferroelectric Capacitors On 51 Substrate
12. Failure Mechanism And Reliability Analysis Of Cu Interconnect Structures Under Thermal Stress
13. Investigation On Chemical Mechanical Polishing Performance Of Novel Copper Diffusion Barrier Of Ru,Ru-Ta Alloy And Mo Film
14. Investigation Of Chemical Mechanical Polishing Of Novel Diffusion Barrier Co/TaN For Cu Interconnect
15. Simulation And Analysis Of Thermal Stress Of Cu Interconnect Structure In IC
16. The Analysis And Research Of Cu Interconnection Failure
17. Capacitance Model Building For28nm Cu Interconnect And The Effect Of Thermal Treatment On Interconnect Wire
18. The Solution To The Bubble Fefect Problem In0.13μm Copper Interconnection Process
19. A Study Of Preparation And Thermal Stability Of NbxSi1-x Diffusion Barrier Layer In The Cu Interconnect Of Integrated Circuit
20. The Study Of Copper Interconnect Reliability Based 65nm Process
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