Pcu03-abs Chip To Improve The Final Test Yield

PCU03_ABS chip produced by Freescale for Germany Continental TEVES Company was studied.Practice guidance was gained in final test program improvement,test condition improvement and probe test program improvement. These action cause the yield improve and reduce the final test cost.Problems appeared during the test were discussed,therefore the operating process of chip was gained.The key point was focused on the solution for low yield of PCU03_ABS.To pick the failure part in low temperature test from wafer successfully by the relationship between wafer test and final test to improve the probe test,as a result high quality rate was gained.Through test program improvement,the failure part was scan out.The final test yield was improved 15%,total saving 78K$ every year. Reduce cost and shipment capacity was increased by the research on increase of quality rate of PCU-03 chip.