Single-chip Power Management Chip Design

Power management chip is the effective distribution of the power supply to different components of the system, power management by reducing components power consumption when components idle which lead to save power for the entire system. Power management chip has wide application in many fields for example in the post and telecommunications, instrumentation, industrial equipment, consumer electronics. Power management chip provide a stable and efficient power and to make an important contribution to energy conservation.BCD (Bipolar CMOS DMOS) process is the Bipolar devices, CMOS and DMOS power devices while the devices integrated on the same chip. It combines the high transconductance ,high load drive capabilityof bipolar devices with CMOS devices which have high integration, low power consumption characteristics. This process also have high power advantages. So the BCD process is most suitable the power management chip.The main subject of this research is based on single-chip high-voltage BCD process development and implementation of switching power supply circuit. In terms of construct a stable process platform with less lithography mask levels, 700v/40v/5v devices compatibility, integration a low on-resistance 700v LDMOS device. And to verify the LIGBT turn-on switching frequency and power consuption relations in order to meet the under use of different power with optimal trade-off between frequency and power consuption to match the power management .In the control circuit,use the cooperative development of the process platform to design a AC-DC converter.Power management chip has complete functions such as : constant flow and constant voltage output control , timing control, PSM (pulse-cycle Skip Modulation) control, a variety of fault protection, circuit adjustment, current limit adjustment, power device switiching control.According to project design requirements for device selection and design determine the overall process. Use MEDICI and Tsuprem-4 software to complete the process and device co-simulation. Obtained the device structure and size by simulation . Tape out device and test. Extraction of device parameters and the establishment of device models the models use for switching power supply circuit design and simulation. The chip contains a band gap voltage reference, current limit comparator, 5.8v regulator ,oscillator, and so on, to control the status of the high voltage switching device.Complete circuit simulation using Hspice and complete circuit layout using Cadence. Finally use the cooperation development BCD process to flow the chip and package, test.