| With the wide application of microelectronic products in various fields,the demand for chips in the market has increased dramatically.It plays a leading role and leads the development of chip packaging technology in the direction of high efficiency and low cost,which has brought great challenges to the traditional Flip Chip packaging technology.In order to improve chip packaging efficiency,this paper proposes a novel double-turret ultrathin chip transferring(DUCT)process.In addition,in order to ensure the reliability of the DUCT packaging system,the inverted chip peeling technology,chip synchronous transfer technology and chip movement placement technology are analysis,and the technological process,process mechanism and process parameters are analyzed and optimized,which laies a theoretical foundation for the realization of the DUCT process.The contents of this paper are as follows:1.In order to solve the problem of low efficiency of chip packaging,based on the principle of parallel motion planning,this paper innovatively proposed the DUCT process,and established a mathematical model of the chip packaging efficiency.The influences of the technical parameters of the packaging system on the chip packaging efficiency are revealed,and the packaging actions are optimized.After optimization,the chip packaging efficiency can reach 25 K chip / hour(CPH),and the problem of low efficiency of traditional chip packaging can be solved.2.In order to solve the complex and time-consuming problems of traditional chip flip process,the inverted ultrathin chip peeling technology is introduced in this paper.Based on the principle of fracture mechanics,an effective tape-adhesive-chip structure with ejecting and spring forces is established.The chip peeling behavior is analyzed by the theoretical model and the finite element simulation,and the influences of different processing parameters,such as chip thickness,spring stiffness and ejecting force on chip peeling behavior are analysed.A chip process window is set up to get the optimal combination of process parameters for guiding the chip peeling in actual working conditions.3.In order to get the high efficiency of chip transfer,this paper puts forward the ultrathin chip synchronous transfer technology,and a mechanical model considering the chip alignment is established.The influences of core transfer parameters on the mechanical behavior of the chip transfer are analyze.In addition,in order to find the optimal process parameters for chip transfer,a process window is set up to provide theoretical guidance for the reliable chip tranfer.4.In order to improve the efficiency of chip placement,this paper puts forward ultrathin chip movement placement technology,and a mathematical model considering the chip initial speed and the the chip packaging efficiency is established to reveal the relationship between the chip initial speed and the the chip packaging efficiency.In addition,in order to analyze of chip placement precision,a dynamic model of chip movement placement considering chip initial velocity is established.Based on the mechanics principle,the dynamic equation of chip motion is derived,the mechanism of chip movement placement is studied,the influences of core process parameters on the positioning precision of chip are analyzed,and the process window is established,which provides guidance for the practical chip movement placement.5.The experimental platform of inverted ultrathin chip peeling and ultrathin chip movement placement is set up in this paper,and experimental researches under different working conditions are carry out,and the reliability and effectiveness of the theory of the inverted ultrathin chip peeling and ultrathin chip movement placement are also verified.In addition,the process capability coefficiences of the inverted ultrathin chip peeling and ultrathin chip movement placement are analyzed and calculated,the feasibility of the DUCT process is demonstrated,which provides a practical basis for the process scheme. |
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