The Application Of Computer MB Failure Analysis Base On Six Sigma

This thesis is an improvement case study which digs into the computer's MB failure analysis in terms of six sigma theory. With the global economic development and the improvement of consumer demand, while the competition environment getting severity, even those global top enterprises could not ignore such situations. They try to pursue high-quality products and reduce waste, so keep successful in the marketing. Our company is the manufacturing enterprise specializing in all kinds of mother boards, in order to pursue bigger profit, must improve quality, and reduce the return rate of the products. To achieve that, the root cause clarification of defects (failure analysis) is more important to engage in continuous improvement. The key point thesis study is to find out the failure root cause by analysis defective motherboards, propose the improvement plan, and carry out the follow up of implement and actual improving effectiveness.The thesis explains the origin of the topic through enterprise internal needs firstly. Secondly introduces computer's motherboard production process and the failure of current situation and failure analysis techniques, specify the failure modes and failure mechanisms of the motherboard. Then introduces foundation of the six sigma statistical methods, and guides and solves the practical problems through typical procedure methods of the six sigma. Finally, lists special case for further study.Six sigma has been proven to be the most fundamental method to improve the manufacturing process both in theorization and practice area. This thesis streams based on DMAIC improvement procedure (D-Define, M-Measure, A-Analyze, I-Improve, C-Control) that is to define the problem, measure related data to well know the situation, analyze the root cause, provide improvement plan, and control the problem to avoid any re-occurrence. This thesis starts from motherboard's failure analysis, then use various kinds of statistics methods and analysis tactics to focus research the motherboard's electricity failure. Considering synthetically from aspects as design, material, production, then find out the key impact factor and carry out rational improvement. Finally we can reduce the failure rate and improve the quality of the products after confirming the result of improvement.