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Collaborative Design Of EMC And Thermal Design In The Electronic Equipment

Posted on:2010-03-06Degree:MasterType:Thesis
Country:ChinaCandidate:B HuFull Text:PDF
GTID:2178360272982622Subject:Mechanical design and theory
Abstract/Summary:PDF Full Text Request
The conflicts of thermal design and EMC are more and more in modern electronic equipments,the product test may be moved forward to research stage via simulation,we can find and resolve the problem before the product be produced and reduce the design cost. In order to research the electronic box's thermal and EMC factors, we should establish suitably simulate model which consists the data share, information feedback, modification constantly. This is the collaboration design.According to the structure design, theoretic numerical computation, and simulation of the thermal analysis, electromagnetic test, this paper researched collaboration of EMC, thermal management. First, author modeled a thermal management modeling , found the key factors that affect the temperature; Second, simplify the modeling by the EMC test request, test the electromagnetic shielding effectiveness; At last, found the best result by all experiments which both cater to thermal design and EMC.This paper shows many factors of temperature and electromagnetic capability, and find out the"Collaboration point", consulted the simplified rule and simplified the modeling, analysed the result by used the Flotherm and FloEMC software ,complemented the collaboration design theory of thermal design and EMC.
Keywords/Search Tags:Thermal-management, Electromagnetic-compatibility(EMC), Collaboration design
PDF Full Text Request
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