Optimization Of Absorbing Material Attaching Based On Three-Field-Coupling In Electronic Equipment

With the development of modern electronic technique, the EMC technology has already entered a stage of high speed development. As an important aspect of the EMC technology, the electromagnetism simulation technology is confronted with more and more challenge nowadays.The traditional electromagnetism simulations which usually carries out single electromagnetism analysis on one aspect, is not able to give the most effective design. Designer needs to consider not only the electromagnetism compatible function, they also has to give consideration to the heat dissipation parameters and fulfill the needs of machinery intensity at the same time, such works gets the optimum design.This paper mainly focus on the problems existed in the emulation of the traditional electronic equipment. Combined the scientific research of the electromechanical institute in Xidian University, the multidisciplinary simulated optimization of electronic equipment is studied.This paper mainly focus on EMC analysis, and it also gives consideration to other function such as heat dissipation and structural strength at the same time. Simulation and optimization technology in the paper has been widely applied in the paper.At the beginning of this paper, the basic theory of MOM(method of moment) is introduced, in the next chapter of my paper, concrete detail of the EMC simulation problems and Software Implementation was discussed. And in the last chapter, a typical model with absorbing material was built and studied.