| As the heat flow density soaring in electronic device, thermal design and thermal analysis is holding more and more important position in the whole design. This paper introduces the development of thermal design and analysis in the world, and it shows the importance of the thermal simulation technique based on computer in the thermal design and analysis filed. Taking Flotherm as the simulation tool, this paper have been done the works as below:(1) First,this paper introduces the principle of the software how to use the finite volume method to solve the thermal field. Combining the project problem, this paper discusses some of the equivalent model building method for the electronic device module. These methods contain lumped block, equivalent resistance substiution, equivalent thermal resistance network, the model building of PCB and Zoom-in method. This paper discusses these methods principle, appliance domian, advanttage and weakness, moreover takes the practical example to illustrate.(2) The second step, paper computes three different construction servers with the equivalent method above mentioned, analyzes the result and gets the imformation of the thermal field and flow filed in the server's crucial places. Holds the temperature testing experiments for two servers, gets the test resultsand the simulation results to compare.(3) Then, taking the heatsink as the analyzed object, paper discusses the consitution of thermal resistances, and optimizes three design varialbes(base height, fin numbers and flow velocity)of the heatsink, utilizes three different methods(analyze algorithm, factor analysis, successive optimization) to get theminimum thermal resistance. Compares this three methods through the final points.(4) Finally, the paper summarizes the principle of the selection of fan, combineing the thermal and nosie filed to get the elements for two field consideration. Finially, this paper discuss the system resistance effect for the fan pressure. |
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