Electronic Components, Thermal Analysis Applied Research

Increasing scale of integration and consumption of power has led to the significant increase in power densities encountered in modern electronic equipment. If we do not pay attention to the thermal management of electronic equipment, the large amount of heat generated by the electronic device would not be under the control. Especially in some atrocious surroundings, some devices' working temperature would exceed the rated temperature limit and lead to deteriorate the system stabilization or even make the hole system disabled . The research object of this thesis is a chip-array that is fixed on one of Printed Circuit Boards (PCB), which are located in a forced air field (forced convection) in an electronic case; and from the essential equations of airflow we can deduce the mathematical model of the turbulent flow; then we can establish the finite element algorithm and apply the FE software to work out the equations of turbulent flow, finally we can use the software to display and analyse the field of flow and temperature. After the simulation, we can get the working temperature of individual chip. Now if we suppose that the rated temperature limit of any chip were identical, confining the highest temperature in the rated limit is the most important, for this purpose I apply the principle of annealing algorithm to the optimization of place distribution design. Under the unvaried condition of thermal dispersion, we can get the least temperature of the maximum value in some kind of chip array.Through applying the CAD software, this paper not only searches after the methods and traits of I-DEAS when it is used in solve complicated electronic equipment design, but also offers useful reference to the reliability design of devices, and settles a base for realizing the CAM for the electronic equipment design.