| With the great development of electronic and information technology, the corresponding problem of thermal malfunction has become the bottleneck which is restricting the electronic equipment integrated design. Under the nature convection environment, the optimal palace design of the electronic device is one of the most effective ways. However, at present there is not a mature theories and mathematical methods to resolve this kind of problem, in terms of the study of the situation at home and abroad. The Particle Swarm Optimization(PSO) compared with other Evolution Algorithm have its own advantages like easier algorithm structure, faster running speed, less parameters to set up and so on, and now it has been applied in many territories. So I used PSO in my thesis to do some elementary research on electronic components' thermal placement optimization on the PCB's board of some electronic devices, at the same time, This approach to improving the reliability of electronic devices is of great significance.In this paper, the research object is a chip-array that fixed on one of PCB, which are located in a natural convection. And the first step is using methods of differential element's thermal heat balance to establish the mathematic model of thermal conduction in the steady temperature field. After the establishing, we can get the working temperature of individual chip. The second step is applying the Icepak software to emulate the physical model and validate the mathematic model, analyzing the reasons of error production. On this basis, in order to make the temperature field of PCB rationalizing, with the MATLAB's program realize the PSO to the optimization of place distribution design. Under the unvaried condition of thermal dispersion, we can get the least temperature of the maximum value in some kind of chip-array, only depend on replacing the place of chip array. At the end of, this process is proved feasible in an example. |
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