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The Research Of Transporting And Pasting Mechanisms For LED Frame

Posted on:2009-07-27Degree:MasterType:Thesis
Country:ChinaCandidate:X X LinFull Text:PDF
GTID:2178360242491862Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
LED die bonder is a device with optical, mechanical and electronic integration. And it is key equipment during producing LED. Its performance makes great effect on the productivity and performance of LED. Except moving the LED frame into and out of the machine, the thesis LED die bonder can do the rest die bond job automatically. This function can meet the needs of small LED packaging firms.The research and development of this vertical LED automatic die bonder are composed by many function modules, and this thesis includes the following aspects:(1) Design a feed-in mechanism.Design the compose parts of feed-in mechanism, including the LED frame sustaining machine and turning machine. According to controlling the speed and position of sustaining board and turning board, the magnet could rightly extract the LED frame, and through the testing of contact sensor, it can finish to apart and pick up the LED frame.(2) Design a feeding mechanism.Design key compose parts of feeding mechanism, including the LED frame pushing machine and hook claws machine. According to controlling the strap motion of pushing machine, it can regulate the pushing position of LED frame.Design a targeted pressure round to position the moving frame. Then design a dual-cams machine, so that it can control the hook claws machine to achieve the LED frame of rapid high-precision position to repeat, so that it can complete the LED frame of the transportation function.(3) Design a collecting mechanism.Design the compose parts of collecting mechanism, including the cams machine and frame pushed machine. According to controlling the coordinated action of the cams machine and frame pushed machine, this mechanism can make LED frame to complete the unloading and collection functions.(4) Design a pasting mechanism.Design the compose parts of pasting mechanism, including the eccentric round machine and XY fine-tuning table. According to turning up the XY fine-tuning table, the mechanism can complete high-precision position to turn up and orientation. Then through controlling the eccentric round machine, so it can drive the V-shape linear guide to complete to guide syringes pasting the silver paste by the vertical direction.(5) Introduction of motion control system, and the research and realization of the movement curve algorithm.The motion control system is the key component of realizing the automation of vertical LED automatic die bonder as well as its difficult part. This thesis will introduce the motion control system in detail, and study the trapezium speed curve and S-curve algorithm, then complete its realization for pasting mechanism.This thesis will finish the structure design of feed-in mechanism, feeding mechanism, collecting mechanism, pasting mechanism, and the choice of standard parts; introduce the motion control system; study the movement curve algorithm, and integrated control logic and control timing requirements, using DMC3000 motion control card to control the pasting mechanism, so that it could meet the high-speed, high-precision requirements. Among the design and development results have successfully processing and assembly of the physical prototype and applied to the actual production of enterprises.
Keywords/Search Tags:LED, Motion control, Die bonder, Movement curve algorithm
PDF Full Text Request
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