Research And Realization On Correlation Techniques Of High-accuracy Chip Bonder

Appropriate in photoelectron industrial assembly line which requests specially tiny size and high accuracy, Chip Bonder is an automatic facility with high precision.This research discussed the system principle and design method for overall structure of the high-accuracy Chip Bonder. Chip Bonder is mainly composed of vision systems,Three-dimensional platform and program Motion Control.This article is mainly aimed at composition of the Chip Bonder and related core technologies to develop the following performance:First of all, we discussed the composition of vision systems. To apply to the practical application environment,we use machine vision to accomplish Image Processing and identification. In the aspect of image segmentation, our article introduced an image segmentation algorithm based on Local Binary Fitting,and we have got anticipated result by experiments. Then we introduced target localization and coordinate conversion in the vision systems ,as well as program completion.Next,in the research progress of Three-dimensional platform, the article introduced the structure of Three-dimensional platform firstly .Then we analyzed the resource of relative accuracy in detail ,and we peformed simulation experiment to evaluate dynamic error of the platform. So it has provided real reference for the real-time error correction,and then it can lead the next precise localization smoothly to realize high-accuracy chip operation.At last,we made detailed introduction for the motion control module of the Chip Bonder.It contains the pneumatic system,electricity-control system,ervomechanism and related hardware.In the mean time, related to the motion control strategy, it explained the method of motion control at present,as well as its advantage and shortcoming. Finally,we proposed a designed method of Program Motion Control system, and have illustrated its practicity in operation.