Design And Development For The Control Of The Archetypal Die Bonder System

In the manufacturing of electron equipment, the electron equipment hanged behind the developed country, facing the situation, Department of Science and Technology set the 863 item in the tenth five-year plan. Its stratagem objective is those key electron equipment, the motive is to realize the double-quick development for the technology and the industry of the electron equipment. The die bonder control system realizes this kind of the electron equipment in china.The whole design of die bonder control system for hardware and development for the software are included in the paper, and the module of movement control and pneumatic control about the die bonder system are developed.The motion control, pneumatic control and visual sensor make up of the die bonder system. Due to using Open-CNC Based on PC for die bonder system, choosing capture grab card, step-motor control card and numeric I/O card and connection between model and computer compose the whole hardware design. The design of modularization and the way of the data exchange between the modules are included in the whole design of the software.The movement control module in the die bonder system consists of the hardware and software development. The hardware development includes the connection between step-motor control card based on ISA bus and the computer which realizes the position control, computer inputs pulse instruction to the step motor by PCL839 motion card. Inputted pulse instruction consists of its frequency and the amounts. After the data is received by the step-motor, the step motor will run in a given frequency and direction. Then the position control of the die bonder system is realized. Software development mainly includes the control of a wafer table, the control of Printed Circuit Board table, the control of bonding arm and bonding head, the control of an eproxy arm and an eproxy head, the continuous control of bonding process and single step test of bonding process.The pneumatic control module in the die bonder system consists of the hardware and software development. The hardware development is based on the connection between data I/O card based on PCI bus and computer to realize snatch control, computer control of the electronic valves by I/O card is used to change the direction of gas pathway. Software development includes testing the status of the sucker and film independently, control of the electronic valves, consistent control of the pneumatic system, setup of position parameter for the pneumatic system.With the whole development for die bonder control system, ordinal control of snatching wafer, orientation, placement are achieved.