Research On Key Techniques Of LED Die Bonder

LED die bonder is automation equipment for contact LED chip with wire bonding framework, bringing together technologies and skills image processing, pattern recognition, photoelectric detection, computer control and electromechanical integration. Its performance makes great effect on the productivity, production efficiency and the passing rate products of LED.Packaging equipment domestic currently relies mainly on the import, we learn from the advanced equipment designed LED die bonder. LED die bonder is made up three modules. There are mechanical structure module, the main control module and visual positioning module. And mechanical structure module consists of the LED frame into and out of machine, leadframe transfer mechanism, XY wafer movement mechanism, eject pin, epoxyn dropping mechanism and picking adhesive mechanism. Based on the analysis of system structure and working principle, the design of control system, visual position system, control sequence of pick up and mount chip has been carried out. The specific contents are as follows:Firstly, the process of LED die bonder was presented; LED die bonder is made up three modules. There are mechanical structure module, the main control module and visual positioning module. By analyzing working principle of LED die bonder, the campaign is designed more reasonable flow chart.Secondly, a motion control sydtem base on industry PC, I/O borad, motion control borad, stepping driver and stepping motor has been established in this thesis, which is in charge of the management and handling of different input and output signals, controlling and coordinating all mechanisms to finish the set motion mode and the precise displacement with the assistance of detecting sensor.Thirdly, visual position system is made up of image capturing borad, CCD and optics parts. Image preprocessing and image matching technology were detailed briefly, for the precision control of the sticky admission process. Finally, the controlling software from structure, function and task, interfaces were planned and designed. Which more, we studied control sequence of pick up and mount chip and motor calibration method.