Software Analysis And Design Of The Fully Automatic Gold Wire Bonder

The fully automatic gold wire bonder is a modern micro-electronic wrapping equipment that utilizes interdisciplinary technologies such as precision mechanism, automation cybernation, image recognition, optics, ultrasonic heat-pressing sealing and so on. It is mainly applied to bonding the chip solder-pane with the outer-frame down-lead in the post-processing of the integrate circuit manufacture.My work here is to develop the system software for the fully automatic gold wire bonder, and the following researches and experiments are conducted.First, we introduce the working principle of the fully automatic gold wire bonder, analyze the software requirement of the machine. Give the machine structure, machine hardware, system software structure design and the basic design method.Second, we discuss the Sub-module based on the fully automatic gold wire bonder, such as motion control, machine vision, material hand system and calibration system. Every module analyze the principle, functional requirement, hardware, software structure and Code implementation. Also we introduce the auto run program of the machine.At last, we test the fully automatic gold wire bonder machine system software to verify the software design. we improve the problem, The improved system software meet the design requirements.