Developing And Studing On Simple LED Die Bonder

According to studing on the process of epoxyn dropping and chip placing in LED packaging , the thesis tries to develop a simple LED die bonder. The thesis has studied and discussed the designs of motion mechanism , controlling techniques, location methods that based on pattern recognition , motion controlling algorithm , motion sequence , etc . Some design methods and control algorithms of it have the certain academic and practical value .This simple LED die bonder is made up of five mechanisms and two control modules. Five mechanisms are as follows: epoxyn dropping mechanism , die bonding mechanism , leadframe transfer mechanism , chip feeding table and illumination adjusting setting . Two control modules are motion control module and pattern recognition module .The main research in this thesis are as follows:1 ) Mechanism design: the jobs of comparison, analysis and choosing have been done to some important mechanism in this thesis . Particularly on the epoxyn dropping mechanism and leadframe transfer mechanism , which have been given detailed design work . The drive methods of those two mechanism are base on the stepping motor , cam mechanism and some other auxiliary mechanisms , which has the characteristics of simple, low cost and appropriate precision . What's more, the detailed design and checking process of cam are also provided by this thesis.2 ) Motion control module design: A motion control system base on industry PC , I/O board , motion control board , stepping driver and stepping motor has been established in this thesis , which is in charge of the management and handling of different input and output signals, controlling and coordinating all mechanisms to finish the set motion mode and the precise displacement with the assistance of detecting sensor.3 ) Pattern recognition module design: it's made up of image capturing board, CCD and optics parts. Through employing the optimal algorithm base on pyramidal structure search and sequential similarity detection algorithm(SSDA—reference to partner Luoding's thesis named study on the simple LED die bonder—study on eject pin mechanism and image recognition system to get the detailed information) to recognize and locate the LED chip. The detailed calibration algorithm of pattern recognition and displacement controlling algorithm of chipfeeding table have been introduced , and the precise displacement control have also been realized in this thesis as well.4 ) Controlling software system design: planning and designing the controlling software from structure , function and task, interfaces, etc . According to the process of chip placement and the characteristics of different mechanisms , original position returning method , time sequence of movement and the velocity parameters are studied as well . The whole controlling software system has been designed to be friendly , intuitionistic , easily operation.