The Research Of The Image Recognition System For Intelligent IC Wire Bonder

Integrate circuit (IC) is the foundation of modern information industry and information society. IC industry has become the basic and strategic industry of national economy and national defence construction. At present, the IC design and manufacture level of our country has existed a large gap comparing to the advanced country of the world. Therefore, to exploit IC manufacturing equipment is of great significance to the development of the integrate circuit industry of our country.Wire bonding today is used throughout the microelectronics industry as a means of interconnecting the chips, substrates and output pins. As Ics continue to become more sophisticated and minimum feature sizes keep shrinking, the need for higher accuracy in fine pitch interconnect applications has become more important than ever. The problem of fixing position is involved in every step of lead-bonding technics process. In the past, this work with high repetion and aptitude can only be finished by people's eyes, but sometimes it is impossible for people to do this work continuously and steadily by their eyes.This paper uses machine vision technology and digital image processing technology to realize the image recognition system of the intelligent IC wire bonder. The primary research content of this paper includes:Firstly, an all-around study has been done on how to locate the IC lead-frame. On the left-down side and right-up side of the IC lead frame, there are two very obvious circularity sign by which the potential region of the circularity sign can be calculated. Capturing the digital image in the potential region of every circularity sign and acquiring the discrete edge feature points by image pretreatment and edge pick-up. Then circular coordinate can be acquired by improved hough-transform and precise position...