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Research On The Control Of Tension And Correction For RFID Automatic Flip Chip Bonder

Posted on:2013-01-24Degree:MasterType:Thesis
Country:ChinaCandidate:C B MingFull Text:PDF
GTID:2268330392969580Subject:Mechanical engineering
Abstract/Summary:PDF Full Text Request
With the development of the semiconductor and RFID technology, High-poweredRFID sealing equipment is required. Automatic flip placement machine mainly includeconveying module, fluid dispensing module, stick wafer module, hot pressing module,testing module and the receiving module. Along them, the conveying module is the firstprocess of the production of the label, so the feeding module is good or bad, which isrelated to the precision of production of and qualified rate of the label directly. So theresearch of conveying modules has the very vital significance.The research content of this thesis is the design of the conveying module, tensioncontrol and correction control, and the simulation analysis with different methodsaccording to the established model. The main research contents are as the followingthree aspects in this paper. First of all, the methods of tension control and correctioncontrol are recommended, the way to the tension control is introduced, according to thecomplete function and design requirements of the conveying module, the tensioncontrol and correction control of the conveying module schemes are determined. Twoconveying schemes are designed, ultimately a scheme is determined and the3d modelof the scheme is completed. Next, the modeling of tension and correction is completed,the mathematics model of the tension mechanism is deduced through the simplifiedmechanical model of tension, and the impact factors of tension change are analyzed. Forthe correction, the model of the correction control is deduced based on the geometricrelations of the designed three dimensional models according to the basic theory, andfinally the model of the correction is deduced. Finally, the simulation analysis of thetension and correction control was carried out based on the front of the analysis of thetension and correction. For the tension, the traditional PID control and robust control areused, and simulation analysis for them is completed. Robust control has better controlperformance compared to PID control. For the correction, the block of the whole controlsystem is constructed based on the established transfer function, the PI control and PIfeed-forward control are used, and simulation analysis for them is completed.The research content of this thesis has good guidance significance to the conveyingmodule design, the method of tension and correction control, the established correctionmodel provide a reference basis for later analysis about correction control, thecommonly used PID control can provide the reference in the control of the actualproject.
Keywords/Search Tags:automatic flip chip bonder, tension control, correction control, PID control, H_∞robust control
PDF Full Text Request
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