The Research And Development Of Fully Automatic Transistor Die Bonder

The fully automatic transistor die bonder is a modern semiconductor package equipment that utilizes interdisciplinary technologies such as fine mechanics, auto control, image recognition, optics and so on. It is mainly applied to bind microchip onto lead frame in semiconductor back-end production.The thesis tries to develop the fully automatic transistor die bonder and the following researches are conducted:(1) Overall designThe design of the structures is introduced, including lead frame movement mechanism, bonding head mechanism, etc. The thesis constructs the sub systems of image recognition and motion control, and controls them by an industry control computer.(2) Research on image recognition systemThe image recognition system is the key component of realizing the transistor die bonder as well as its difficult part. Its accuracy will influence the accuracy of the die bonder. First, some digital image pre-processing techniques are provided, and two techniques, the gray histogram trimming and the median filter are discussed. Next, some mainly used image matching algorithm based on gray matching are discussed. Their strong and weak points are pointed out by experiments. An algorithm that meets the demand of the system is proposed. Finally, the thesis presents the theory and method to improve the efficiency of processing image software by using MMX technology.(3) Develop the die bonder's software systemDevelop the die bonder's software system according to company's requirements, and realize bonding triode chips automatically. The software system has the characteristic of simple operation, user-friendly, performance stable, malfunction alert, etc.