Research On High-resolution Chip Electromagnetic Compatibility Test System Based On Quantum Precision Measurement

In the post-Moore’s Law era,chip integration and complexity are increasing,leading to limitations in circuit performance and reliability due to electromagnetic interference between closely arranged modules.Current international Electromagnetic Compatibility(EMC)technology,based on small loop antennas,fails to meet the non-destructive testing and resolution requirements of modern chips.Higher EMC testing standards are necessary to ensure chip quality.This thesis focuses on the application of quantum precision measurement technology in EMC testing and introduces the following research content and innovations:(1)A high-resolution chip EMC testing system is proposed,utilizing the Nitrogen-Vacancy center in diamond as a quantum sensor.Single photons are employed as information carriers to detect electromagnetic and temperature fields.The thesis investigates the relationship between optical fiber collection efficiency and maximum collection angle to improve signal collection.It introduces a tapered optical fiber probe design,achieving over 10 times improvement in fluorescence collection efficiency.(2)The thesis validates the reliability of the proposed EMC testing system for electromagnetic field and temperature measurements.It compares the electromagnetic field testing results obtained from the proposed system with those from traditional spectrum analyzers,showing consistent results.The stability of temperature detection is tested under various conditions,validating the reliability of temperature measurement in the system.The temperature measurement results are compared with those from traditional thermocouples,and the temperature curves from both methods align.(3)This thesis presents practical testing of electromagnetic and temperature fields.Electromagnetic field imaging was performed on a limiting amplifier chip,scanning its surface under different input power conditions.The results confirmed the chip’s expected operation,transmitting signals below the threshold and suppressing them when exceeded.Additionally,the temperature field on an electric heating element’s surface was imaged at varying current levels,revealing the distribution of high-resistance alloy wires and validating the feasibility of the proposed EMC testing system.