Temperature Field Detection And Chip Thermal Efficiency Analysis Based On Diamond NV Center

In the post-Moore era,system-level packaging technology is expected to further enhance the performance of integrated circuits.3D stacking packaging is the technology with the longest development history and widest application in systemic packaging technology.It can package chips of different types and functions together,resulting in a significant increase in the number of electronic devices per unit area of the chip.In serious cases,it can lead to transistor damage and functional failure.Therefore,there is an urgent need to develop a high-resolution,chip-level temperature field measurement and imaging technology to quickly locate the internal heat sources of the chip,optimize the heat dissipation design of packaging technology,and increase the chip yield.This thesis proposes to use the Nitrogen-Vacancy Center,a solid-state quantum bit,as a temperature sensor and to build a temperature measurement system based on quantum sensing principles.The NV center has a relatively long quantum coherence time and optical stability at room temperature,and its spin state can be observed.Additionally,the ZFS of the NV center has temperature dependence.These unique features make NV centers suitable as temperature probes for chip temperature field measurement and imaging.The sensor module is fabricated using a diamond NV center and a tapered optical fiber,which can achieve a resolution in the micrometer range and collect the temperature field information of the device under test.The optical module is used to excite the NV center to generate fluorescence and to collect the fluorescence signal.The measurement and control module generates and controls the pulse and microwave signals for the manipulation of the NV center spin state.The software module is responsible for the automation of the entire system process.The optical detection of magnetic resonance signal detection scheme was optimized and the signal-to-noise ratio of different measurement methods was analyzed and compared.The signal-tonoise ratio of the ODMR signal was improved to over 27 d B.The temperature imaging of metal heating plates under different heat dissipation environments was analyzed and compared with a thermocouple reference group.The NV center temperature measurement system demonstrated better performance.