Simulation Research And Optimization Design Of Heat Dissipation Structure Of UV-LED Curing Device

Ultraviolet(UV)technology has developed rapidly in the printing industry,traditional UV curing has gradually been replaced by UV-LED light curing with the widespread application of the fourth generation of light source LEDs.However,the photoelectric conversion efficiency of the LED is only 20%,and the remaining 80%of the energy is converted into heat.If the heat cannot be dissipated in time,problems of LED such as shortened lifespan,wavelength shift,and aggravated light attenuation will be caused by accumulated heat.The heat dissipation structure of the UV-LED curing device is simulated and studied to improve the performance of the heat sink,which has important and long-term practical significance in strengthening the application research of heat dissipation structure and promoting the rational application of simulation.In order to solve the problem of poor heat dissipation capacity of UV-LED curing device,the heat dissipation structure of the UV-LED curing device is simulated and optimized by Ansys Icepak according to the basic theory of heat transfer and the principle of computational fluid dynamics.Firstly,the 3D model and thermal resistance model of the radiator are established by SolidWorks,and the feasibility of the simulation experiment is proved by theoretical calculation and simulation verification of the thermal resistance of the radiator;Secondly,the model of the heat pipe is reconstructed and the orthotropic property is set,the cumbersome experimental steps and calculation errors are reduced by using the Icepak model instead of the SolidWorks model.The influence of four main parameters of fin height,fin thickness,fin number and heat pipe diameter on heat dissipation performance is studied by single-factor experiment;Finally,the Four-factor three-level orthogonal test is designed based on the optimal data of the single factor experiment results,and the test results is analyzed by using the range analysis method,and the radiator structure parameters are optimized and the ultimate power test is operated.The experimental results show that the junction temperature of the UV-LED has an inverse relationship with the height of the fin,and the junction temperature decreases with the increase of the fin height;the junction temperature of UV-LED has a quadratic function relationship with the thickness of the fin,and the rising trend of the junction temperature increases with the increase of the thickness of the fin;the junction temperature of UV-LED has a quadratic function relationship with the number of fins,and the rising trend of the junction temperature increases with the increase of the number of fins.The optimized heat sink has the best heat dissipation performance when the fin height is 56 mm,the fin thickness is 0.5 mm,the number of fins is 22 and the heat pipe diameter is 7 mm.The heat dissipation capacity is increased by 23.5%,and the working power should not exceed 173w.