Analysis Of Heat Transfer Characteristics And Structure Optimization Of Chip Self-Cooling Structure

With the rapid development of electronic technology,the thermal power consumption of the same volume chip is getting higher and higher.At the same time,the volume of electronic products becomes smaller,the function becomes more,and the structure becomes compact.As a result,the operating temperature of the components in the electronic device will continue to increase,and the reliability of the chip will also decrease.In order to ensure that electronic equipment does not generate excessive temperature rise and improve the reliability of the entire system,thermal design plays an increasingly important role in the overall design of the product.In this paper,the geometric model of the self-heating structure is designed and built according to the actual needs,and the heat transfer characteristics of the heat dissipation structure are analyzed.The structure is optimized.The specific research contents are as follows:Firstly,the author analyzes the importance of electronic cooling technology and the development status at home and abroad.The basic theory of heat transfer is expounded,and the theory of natural convection heat dissipation and the theoretical analysis of heat transfer of straight rib heat sink are elaborated.Then the author designs preliminarily the heat dissipation structure that is required.The author analyzes the heat source and thermal resistance and constructs the thermal resistance network of the chassis for heat dissipation structure.The common chip package simplified models and features are analyzed.The FloEFD software was used to analyze the external heat dissipation fin structure parameters,chassis casing and heat transfer fin material,heat transfer fin structure and heat transfer fin thickness on the heat dissipation effect of the chassis.Based on the orthogonal experiment and simulation analysis,the author optimizes the structural parameters of the external heat dissipation fins of the chassis.Through the analysis of the data,the author determines the primary and secondary factors that affect the heat dissipation effect.And the author obtains the optimal combination of the structure parameters of heat dissipation fin.Then the simulation analysis is carried out,and the rationality of the optimized design is verified by analyzing the simulation results.According to the experimental and testing requirements,select the correct experimental equipment,set up a reasonable experimental environment,and place the engineering prototype at 20?,50?,60? test temperature for experimental testing,and then the experimental test data and pre-simulation results,The design of the heat dissipation structure requires comparison to determine the accuracy of the thermal design.