Thermal Design And Optimal Design Of Heat Dissipation Structure For

The structure of the electronic product becomes much more compact and small. The layout of the high power devices, the design of the heat dissipation system and the reliability of the thermal design become the key factors that affecting the product quality. Due to the above reason, the thermal design and thermal analysis of the electronic products become an important research topic.This work is based on the cooperation of our company and the police. The name of the project is " City Public Security Bureau Public Security Comprehensive Prevention Platform".The author’s main job is the thermal analysis of a "Check Point Machine" board. Through the analysis, the reasonable layout of the mainboard and the device, the optimal design of the hot flow channel are ensured. The equipment is used in government agencies, city check point, city entrances and other occasions, and some relatively poor workplace, such as highways, ports, terminals, etc.. The reliability and life of the equipment is seriously affected by its work conditions, such as sun dry, high temperatures, high humidity, salt spray and industrial gas pollution. Limited by the table size, the board, the second generation ID card, touch screen devices are lumped in a limited volume, so the thermal design and thermal protective become a prominent contradictions.Based on the analysis of the heat source device on the motherboard CPU and South Bridge, in this work, according to the package thermal characteristics of components, the detail analysis of the component layout in PCB is carried out. The specific shape of the heat sink and the fan parameters are obtained, the assembly structure of the components and reasonable hot aisle are determined.The device has passed the high and low temperature, shock, vibration, and other routine tests, and can be applied in Xinjiang, Tibet and other harsh environments, prove that this scheme is reasonable and effective. I hope this article designed to provide a useful reference for similar electronic products.The heat flow within the device are analyzed by the simulation work. The simulation results show that the cooling capacity of the motherboard is effectively improved by the designed cooling solution. The designed device has passed the high and low temperature, shock, vibration, and other routine tests. It has been applied in in Xinjiang, Tibet and other harsh environments, which in turn proves the reasonable and effective of the design method. The design ideas and methods of this paper will provide useful reference for similar electronic products.