Electro-thermal Analysis And Optimization Design Of Microwave Interconnection Structure

With the maturity of the fifth generation of mobile communication technology and the development of millimeter wave communication technology,the demand for miniaturization of wireless communication systems is getting higher and higher,and the trend towards highly integrated system is getting faster and faster.At present,with various advanced packaging technologies emerging and electronic micro-assembly technology advancing,the communication systems are rapidly developing towards high integration,high frequency,wide band and high power.It has attracted widespread attention in academia and industry.At the same time,as communication systems continue to evolve towards high power and high frequency,there are also some issues to be studied and resolved.Firstly,high-power signals in wireless communication systems will cause serious electromagnetic-thermal problems.Accurate simulation and measurement analysis of electromagnetic-thermal effects of passive interconnect structures are becoming more and more important.Secondly,with the millimeter-wave system-level packaging technology continuous maturity,wire bonding is still the most important form of interconnection due to the characteristics of flexible application,mature technology and low-cost.It is necessary to focus on the optimization design of millimeter wave band wire bonding interconnection.In this paper,some of the key issues of the microwave interconnect structure are studied,and corresponding solutions are given.The main contents of this paper include: Firstly,for the analysis and verification of the electromagnetic-thermal effects of passive interconnect structures,this paper takes microstrip line and branch line coupler as the research object,considering the change of substrate characteristics during processing and influence of the connector during thermal measurement,and accurate electromagnetic-thermal simulation models are built.Then an electromagnetic-thermal measurement system is setup,and the consistency is verified between simulation and measurement in various scenarios.Secondly,for the optimization design of bonding wire interconnect structure,this paper uses two methods based on stepped impedance matching and quarter-wavelength impedance transformation matching to achieve good impedance matching,and verifies the feasibility of wire bonding interconnects in millimeter wave packaging systems.