Research On Gold Wire Bonding Process Parameters On The Influence Of The Bonding Quality

Gold wire bonding is a kind of ultrasonic vibration and bond through the f orce of interaction,under low temp heating or without heating,gold wire were bon ded to the chip pad and substrate pin,in order to achieve the physical interconne ction between the chip and the circuit substrate.It’s important to analyze the para meters affecting the bonding quality and find the key parameters affecting the bo nding quality,which has theoretical significance and engineering application value.According to the working process parameters gold wire bonding and ultrason ic bonding principle gold wire bond,the paper research the quality of gold wire bonding study selected ultrasonic time,ultrasonic power,time burning ball burning current ball bonding pressure,bonding temp of six factors.As detail process shows,firstly,the direct bonding test of glass silicon anode was carried out,study on bon ding time,the contact area,the influence of temp on bonding quality.Secondly,since the process parameters have an impact on the quality of the gold wire bonding more,so the study were selected and six factors and five levels orthogonal test method,and select the copper substrate and the silicon substrate two comparative tests of different substrate conditions,process parameters on bonding quality is co nsistent.Finally,as the principle of multiple linear regression,using Matlab linear fit test data to verify the fitting result,and using the fitted equation to estimate and predict the range of the bond and the rate of the selected conditions.Gold wire bonding process parameters shows that there are many factors tha t affect the bonding quality,effect of bonding temperature on the bonding quality of the most significant,but other factors affect the level of slightly different.Ultras onic power of gold-copper compared to the larger,ultrasonic time,the current burn ing ball of gold-a greater impact compared to silicon.According to regression mo del,using the fitting bond rate under multiple linear equation estimates and projec tions of the optimum value condition is reasonable value interval.Select the appro priate process parameters during processing has important engineering value.