Electromagnetic-thermal Analysis Of Passive Components And Design Optimization Of High-speed Interconnects

With the application of millimeter-wave band occupied by the fifth-generation mobile communication technology and the popularization of mobile communication electronic consumer products,the miniaturization trends of electronic systems are becoming more and more obvious and system integration requirements are also increasing.Due to the increasing integration of electronic systems,integrated systems on silicon substrates face multiple challenges such as process limits and physical limits.As the main driving force for the wide application of millimeter wave spectrum,miniaturized microwave and high-speed system has gradually developed into high-density,multi-function,wide-band and heterogeneous integration characteristics,and can effectively deal with the failure of Moore's Law.Therefore,microwave and high-speed system has received extensive attention.At the present stage,applications of microwave and high-speed system are gradually expanding towards high power and ultra-high speed fields,because of the continuous development of electronic assembly process,the emergence of advanced electronic materials and the rapid improvement of system design capability.However,microwave and high-speed systems are facing some urgent issues due to its rapid advancement.Firstly,heterogeneous integration of high-power devices can cause serious electromagnetic-thermal problems and therefore accurate measurement and rapid analysis of electromagnetic-thermal effects in passive circuits are also critical.And with the increasing popularity of microwave and high-speed systems,the bond wire interconnection still occupy an important position due to the flexible design,reliable performance and low cost characteristics,so it is necessary to consider how to achieve broadband matching of the bonding wire.Furthermore,as integration level develops,the distance between components is gradually reduced and the isolation is getting lower and lower.Therefore the noise interference problem faced by the system is increasingly prominent.In this paper,the key problems mentioned above will be studyed and corresponding solutions are proposed.The main contents of this article are introduced as below.Firstly,aiming at the rapid simulation requirements of the electromagnetic-thermal effect in passive components,an accurate equivalent thermal conductivity formula for conductor cross-section is proposed.Furthermore,an analytical formula for the electromagnetic-thermal distribution of microstrip circuits are proposed combining with the electrothermal equivalent principle.The temperature distribution of the open stub filter model is calculated and it is highly consistent with simulation result.Secondly,in order to obtain electromagnetic-thermal effects of passive components accurately,an effective electromagnetic-thermal measurement system is realized,and microstrip and branch line coupler samples are measured for the first time under natural convection and constant temperature boundary conditions.Combined with the modified thermal parameters of the simulation model,the results of the three-dimensional electromagnetic-thermal-fluid joint simulation are finally consistent with the test ones.Thirdly,the multi-stage step impedance transmission line model is utilized to convert the high-frequency or high-speed bonding wire impedance compensation problem into the target optimization issue.Combined with the iterative optimization algorithm,the matching model can maintain the signal bandwidth as DC-120 GHz.Finally,aiming at the common mode noise interference problem in wideband differential systems,a novel ultra-wideband common-mode noise filter are proposed,which realizes 111%fractual-20 dB bandwidth,by cascading defective ground structure resonant unit and introducing comb slow wave structure.