Research On Automatic Assembly Technology Of Microwave Module

With the continuous development of electronic packaging technology,microwave multi-chip components are constantly developing toward miniaturization,light weight,high operating frequency,multi-function,high density,high reliability,high performance and low cost,and put forward assembly and interconnection technologies.More and more high requirements.Micro-assembly technology is an important technical way to achieve the goals of miniaturization,lightweight,high-density three-dimensional interconnect structure and high reliability of electronic equipment.This topic mainly studies the automated assembly technology in the micro-assembly process of microwave multi-chip components,and establishes the complete process flow of the assembly of this type of components.Through the assembly technology of plasma cleaning technology,eutectic soldering process,integrated soldering process,automatic bonding and patching process,automatic gold wire bonding process,etc.,the module achieves high heat dissipation,high performance,high reliability and high integration.Requirements and evaluation of its reliability.The main research contents are:1)Research on plasma cleaning process.Through the plasma cleaning technology,the welding material of the power amplifier chip is pre-treated to improve the reliability of the welding and reduce the welding void rate;the bonding interface is processed by the plasma cleaning technology to improve the bonding strength.2)Research on eutectic welding process.Through the development of tooling fixtures,the vacuum welding curve is optimized to achieve high reliability and low void rate welding of the power amplifier chip;through programming and parameter optimization,small-area chip automatic patch eutectic soldering is realized to improve production efficiency.3)Research on integrated welding technology.Through the design of the fixture and the debugging of the welding curve,the integrated welding of the chip carrier and components of the front and back power amplifier components is realized,the secondary remelting is avoided,the welding process is combined,the welding quality and production efficiency are improved,and the gas phase is used.Cleaning solves the cleaning problem of integrated welding.4)Research on automatic bonding and patching process.The multi-chip adhesive patch is realized by automatic placement machine programming and parameter optimization,which ensures the patch precision,improves the patch efficiency,and realizes the complex high-density,high-precision and high-reliability patch of the microwave multi-chip.5)Research on automatic gold wire bonding process.Through the analysis of the influencing factors of the automatic gold wire bonding and the optimization of the bonding parameters,the multi-chip complex component automation bonding is realized,the bonding consistency and reliability are improved,and the production efficiency is improved.6)Reliability evaluation of automated assembly process.Through simulation analysis,the model was established to evaluate the assembly process of high-power chips,and the environmental test conditions were designed to verify the tensile strength of key wire bonding and the shear strength of special process bonding patches.Through the above research,the automated assembly of miniaturized and high-density microwave multi-chip components is realized,which ensures the high heat dissipation,high performance and high reliability requirements of the components.The process technology of this automated assembly has been applied in several projects to achieve mass production.