Microwave Multi-chip Components Of Micro-assembly Of Key Technologies And Applied Research

The microwave multi-chip module(MMCM) technology is a new generation of microwave packaging and interconnect technology developed on the basis of hybrid microwave integrated circuits(HMIC),and means that the multi -MMIC/ASIC chips and other components are used in three-dimensional(3D) high density assembly of multilayer microwave circuit interconnect substrate to form high-density,high reliability and multi-functional circuit modules.This is the excellent method for realizing high-performance,high-speed,high-density,miniature volume and light weight of electronic modules and systems.This paper research on key technologies and applications of MMCM micro assembly,and the contributions are summarized as follows:Firstly,the research of low-defect chip soldering and defect detection technology were completed by the patented technology(the fixture design method of vacuum eutectic chip soldering),improving the quality of the soldering power die.X-ray and ultrasound layered scan defect detection technology of the welding power die were also discussed.Secondly,the research of the microwave die bonding technology were completed by discussing the requirements of organic adhesive material characteristics and the bonding process,mainly in the distribution of plastic,the curing process and the out-gassing rate. and long-term reliability of temperature impact test.Thridly,the research of gold wire bonding interconnect consistency control technology was completed by the research and development on the application of patented technology using manual bonding equipment,controlling the distance and arch high bonding uniformity of bonding wires,and an initial database on semi-automatic machines was also established.It is ensured that the SPC statistical process controlled the quality of bonding of MMCM.Finally,on the research of the flip chip bonding,the completion of the reliable production of gold bump,numbers of bump flip chip bonding and also flip chip at the bottom of the filling process,it was showed that flip chip bonding satisfied the requirements of shear strength of GJB 548A-96 and long-term reliability of temperature impact test.The research results have been widely used in our institute,played a key role on ensuring product quality,increasing productivity and cost savings.