The Consistent Transformation Of Copper Wire Bond Equipment Of Integrated Circuit Packaging

With the rapid development of copper wire bonding process,the technology of copper wire bonding apply widely to the integrated circuit packaging assembly which is advanced,complicated and sensitive.So the copper wire bonding technology is faced with many new challenges.The one of the new challenge is that when massive amount production at many copper wire bonders,there will be found poor uniformity of product and along with some high-risk copper wire bonding reject.Some of the reject was disastrous;it has a tremendous influence on product life cycle,product reliability.This problem is too difficult to completed solve by copper wire bonding process improving,so need to think new solution from the aspect of the equipment consistency to enhance the uniformity of product,to decease the quantity of disastrous reject of copper wire bonding.It can promote the copper wire bonding to apply to massive amount product of integrated circuit packaging assembly which is advanced,complicated and sensitive.In this thesis,the basic theory of how to improve the copper wire bonding equipment consistency and equipment stability is discussed.Then the novel and improved design and structures of equipment consistency and equipment stability are proposed:1.Find out several kinds of disastrous reject that has the highest correlation with the output factor of copper wire equipment by statist icing the copper wire bonding disastrous reject and counting the relative failure mode analysis.2.Analysis the correlation between the entire relative output factor of copper wire bonding equipment?include the Ultrasonic energy,force,bond-temperature,time and N₂H₂ forming gas?and disastrous reject.Use JMP software to do design and experiment to find out the key output factors of copper wire bonding equipment was the ultrasonic generator.3.Analysis the correlation between the key output factor of copper wire bonding equipment and the bond quality characterization factors?include the ball size,ball thickness,wire pull,ball shear,IMC,crack?,and use JMP software to do design and experiment to find out the key factors of bond quality characterization was the ball shear.Regressive analysis shows it has the maximal relationship with the key output factor of copper wire bonding equipment.4.Analysis the vertical and horizontal differences of key output factor of copper wire bonding equipment to find out the root cause of equipment consistency and stability.5.A novel improved design and structures of equipment consistency and equipment stability is proposed.An optimal test program is designed by using the design of experiment?DOE?method to adjust the compensation factor of the key output factors of the copper wire bonding equipment and reduce the output difference.This method considers the characteristics of the copper wire bonding equipment transverse difference,in the case of other conditions remain unchanged as far as possible,in view of the equipment transverse difference biggest key factor to adjust,make full use of the advantages and feasibility of the design of experiment,not only decrease the difficulty of implementation and for technology improvement especially in process parameter optimization provides the theoretical support.