Copper Wire Bonding Process Technology Research And Application In The Encapsulation

Microelectronics packaging consists of wafer slicing, chip bonding and wirebonding, die block, etc. Several important constituent, the wire bonding connectinginternal chip and the outer lead is an important step. Bonding is a semiconductor chipwelding area and microelectronic encapsulation of I/O pin or the substrate metal wiringof welding area to connect technology with metal filaments. Bonding performancedirectly affects the quality of the components and the yield of encapsulation. Becausethe copper wire has excellent performance and price advantage, with the developmentof the bonding technology, replace the gold wire as a bonding wire with copper wire hasbecome inevitable, packaging industry, many manufacturers are keen to use the originalmodification of gold wire bonding equipment, but there are still many problems. Withgold wire bonding to copper wire bonding technology research as a starting point,through the craft adjustment and equipment modification, make copper wire instead ofgold wire used in existing equipment, at the same time to save the production cost, thepurpose of saving money. Copper wire bonding technology is developing rapidly inrecent years, superfine spacing wire bonding are the main trends of development ofcopper wire bonding.The author is responsible for the copper wire bonding in the practical work, andcarries on the research, now the copper wire bonding in the bonding process is not yetmature, there are lots of problems, to realize large-scale production has a significantimpact, in the work we have studied the problems and solve, but there are still manyproblems need to colleagues to solve.1.5mil copper, for example, there is a parameteris not stable, virtual welding, copper oxide ball, in a series of experimental analysis, wefinally found some methods to control and solve the company’s production capacityincreased by one5.Dissertation detailed introduces the copper wire bonding process, ultrafine copperwire in the spacing face problems in the wire bonding, and in1.5mil copper wire as anexample, detailed introduces the authors experience in the specific production, as wellas the problems encountered in the production practice and research the solution. Dissertation through a series of experiments and analysis, objective analysis, andput forward scientific and reasonable solution, gradually solve the various problems inthe copper wire bonding, and promote to the actual production application. Copper wirefor company further development process and reduce the packaging cost to providerelevant reference, the copper wire bonding technology for the entire packaging industryto provide the reference.