Research On The Composite Hardener Systems For High Performance CCL Based On Epoxy Resin

Copper clad laminate(CCL)is a kind of basic materials for the electronicsindustry,mainly for manufacturing printed circuit boards（PCB）,and it is widely used inelectronic communications and instrumentation.With the development of high densityinterconnection(HDI) and application of lead free processing, the substrate of CCLs shouldhave higher heat-resistance and reliability.The application of phenolic novolac resin (PN) used in the Copper Clad Laminatesbased on Epoxy Resin(EP) is studied in this thesis. In the experiment,the effect ofaccelerant species,curing agent content and soft point of PN on the manufacturing processand properties of CCLs is investigated.Simultaneously,the application of diamino diphenylsulfone(DDS) used in the Copper Clad Laminates based on Epoxy Resin is also studied inthis thesis.The influence of the different curing ageng of EP,such as DDS,diaminodiphenylmethane(DDM),diaminodiphenyl ether(DDE),PN and dicyandiamide(DICY),on theproperties and technics of Copper Clad Laminate is investigated.The effects of solventspecies and accelerant species on CCLs and its performance are mainly discussed too.According to the conclusion of the series of experiment,the technology of compositehardener and combined accelerant are used to develop a product with high property andgood proportion in performance and price.After the testing, copper clad laminate with notonly excellent properties which can gratify the standard IPC4101/126,but also excellentPCB processing characteristics and low cost is prepared by using the composite hardenertechnology.