MCM-D Driver Multilayer Wiring Design And Process Implementation

The development of modern integrated circuits is changing with each passing day,and the production requirements for processes and circuits are increasingly strict.With IC's high speed,high integration,high density,and high performance,circuit feature sizes continue to shrink,and the position of multi-layer wiring in IC manufacturing is self-evident.As a result,the length of the wiring inside the chip and the density of connection lines have rapidly increased.The cross-sectional area of the connection lines has continuously narrowed,and the number of metal wiring layers has sharply increased.This has become a problem to be solved urgently in the microelectronics industry.The development direction of integrated circuit layout design is multi-layer wiring technology,and its research and production level will directly affect the status and role of China's integrated circuit technology in the future microelectronics era.This paper addresses the issues of high-power driver mult-ilayer wiring design and process implementation:First,according to the requirements of high-power miniaturization,based on the existing multi-layer wiring process and the actual process level of the production line,the circuit layout was redesigned,reducing the original product size to 35*26 mm~2;Second,according to the new layout design and dimensions,some of the materials and devices were re-selected,and the optimized process was integrated to prepare high-power multilayer wiring samples.Third,the performance of the prepared sample was tested and the overall design requirements were met.