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Thermal Design And Fan Optimization Of Integrated Computer

Posted on:2020-04-08Degree:MasterType:Thesis
Country:ChinaCandidate:J W QiuFull Text:PDF
GTID:2428330590982997Subject:Power Engineering
Abstract/Summary:PDF Full Text Request
The integrated computer integrates the host computer in the back of the screen,and the host and the screen are placed on the desktop as a whole.This characteristic determines that the comfort of the user must be fully considered in the design of the integrated computer.Therefore,fan noise,space volume and component working temperature are all problems that need to be considered and solved in the cooling design.This thesis takes the thermal design of integrated computer as the research object,designs the layout of chassis and components,and forms a complete heat dissipation scheme.Using professional thermal simulation software,the temperature field and flow field of integrated computer are analyzed.The heat transfer path,distribution of pressure loss in duct and influence degree of outlet and outlet are expounded respectively.The cooling scheme meet the thermal design solutions,but the temperature of CPU and GPU is highe,the size of chassis is large,and the specific structural parameters still need to be further optimized.By means of simulation calculation,the heat pipe installation position,fin spacing and thickness of the heat pipe radiator,the thickness of the chassis and the addition of radiators on the CPU and GPU surfaces are optimized.Under the conditions of 65 W CPU dissipation power,40 W GPU dissipation power and less than 40 mm cabinet thickness,a better optimization scheme is obtained.The cooling scheme can well meet the working temperature requirements of CPU and GPU.The relationship between the convective heat transfer capacity of CPU and GPU surface and the heat transfer capacity of heat pipe radiator on the heat transfer efficiency of CPU and GPU was studied by means of simulation calculation and mathematical model.CFD software is used to simulate the flow field of the prototype heat dissipation fan,and the flow situation of the internal flow field of the fan is analyzed.The aerodynamic performance of the prototype fan was tested with a small air flow meter,and the reliability of the numerical simulation results was verified.Two optimization methods,i.e.changing the number of blades and the opening of volute,are proposed and compared by simulation.After structural optimization,the total pressure and efficiency are increased by 23.4% and 0.061 respectively.In this thesis,through the design and optimization of the cabinet structure and cooling module structure,we get a cooling scheme which can meet the temperature requirement and the cabinet volume is small,and optimize the performance of the heat dissipation fan,so that the heat dissipation capacity of the integrated computer can be further improved.
Keywords/Search Tags:Thermal design, Thermal analysis, Cooling fan
PDF Full Text Request
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