Study On Electrical-thermal Simulation Of Packages And Interconnects

With the development of systems on package(SoP)technology and continuous miniaturization of electronic information systems,integration density of SoP structure is increasing sharply.Consequently,thermal characterization of integrated circuits(ICs)becomes more and more complicated,the rising temperature could influence the electrical characteristics of the ICs and the robustness and reliability of the entire package system.The thermal requirement and electromagnetic-thermal coupling becomes one of the obstacles that prevent the progress of integration,when analyzing and designing the system we have to comprehensively consider the electrical and thermal perspectives.Therefore,the fast and accurate electro-thermal simulation technologies fit for SoP are very important and necessary.This thesis mainly focuses on the electrical and thermal effects of SoP and analyzes the electro-thermal effect of the high-density interconnects,thermal characteristics of the whole package and realize the co-simulation of full-wave electromagnetic fields and thermal fields.In order to meet the accuracy and efficiency,this thesis introduces the alternating direction implicit(ADI)method into the thermal simulation,the algorithm is validated by comparing transient temperature of some cases with commercial software.On this basis,the typical package structures are simulated,the resulting temperature profile is not only useful for package thermal analysis,design and optimization,but also the base of the electrothermal analysis and design.And then the Comprehensive electro-thermal analysis of multilevel interconnects during electrostatic discharge(ESD)pulses is carried out,revealing the necessity of incorporating electro-thermal coupling effects in thermal analysis of interconnects.In simulation,all nonlinearities of temperature-dependent electrical conductivities,thermal conductivities and power consumption are treated appropriately.At last,through the ADI electromagnetic-thermal algorithm,the transient electromagnetic-thermal simulation of Debye media with electromagnetic pulses(EMPs)is carried out,the frequency-dependent and temperature-dependent properties of the Debye medium are taken into account in the modeling.The validity and accuracy of the ADI electromagnetic-thermal algorithm are demonstrated by the numerical example.