Thermal Structure Design And Simulation Of The High Power LED Lighting

Lighting light-emitting diode was compared to the "green revolution" of thelighting, its high efficiency, energy saving, environmental protection, flexible,long life, high security and a range of advantages, become namely, after theincandescent light and fluorescent lamp, an emerging new generation light source.With the continuous popularity of in-depth high-power LED lighting products ingeneral lighting, especially in recent years, the semiconductor lightingincreasingly widespread global concern, but with the continuous improvement ofthe power of high-power LED thermal problems have become increasinglyprominent, limiting the it as soon as possible into the homes of ordinary peoplethe road has also become one of the key constraints to continue to develop,therefore, the thermal problems to be solved.This project is to start from the high-power LED thermal problems, andoptimization of high-power LED lamps the overall structural design, analysis andthermal structure of high-power LED lamps, quickly dissipated a lot of heatgenerated by the LED light chip, and thus effectively improve cooling, increasemore high-quality high-power LED lighting products.Summarized and concise discussion of the global status of the LEDtechnology industry and future development trends, background and significanceof this study. Has a clear purpose to carry out research, and hair from the rootfrom the first LED thermal problems described in this packaging technology forhigh-power LED lamps, than the source of the LED thermal problems, the LEDpackage thermal management concepts, and thus the detailed thermal analysis ofhigh-power LED chip, a complete thermal model, the theoretical analysiscompare with the actual test. Second, the factors mainly affect the cooling of theradiator of high-power LED lamps, a single thermal performance analysis andresearch, and radiator fin thickness, fin number, radiator height, ambient temperature, among other factors and the LED chip junction temperature to drawthe curve with each other, and clearly reflect the impact of various factors on theLED chip junction temperature (ie, the thermal performance of high-power LEDlighting effects). Finally, through the use of thermal simulation of finite elementsimulation, high-power LED lamps radiator to heat the entire lighting clearer.