Research On Technology Of RF Wideband Transceiver Front-End Based On SIP

In today’s era,radar systems and electronic communications are rapidly developing.As an important part of radar systems,people have increasingly higher requirements for transceiver front-end.High performance,high integration,miniaturization,and low cost have become the main directions for the current research and development of transceiver front-ends.SIP(System in Package),as a main three-dimensional package form,can integrate different devices and circuits in a single package,improve the overall system integration,and realize the miniaturization of the entire system.This article applies SIP technology to the front-end of broadband transceivers to study the three-dimensional form of RF broadband transceiver front-end.This article first briefly describes the 3D transceiver front-end,introduces the principle of the transceiver front-end,and the SIP technology and HTCC process;studies the three-dimensional interconnect structure existing in the transceiver front-end,and the important interconnect structure were designed and optimized;the link scheme and the three-dimensional structure of the broadband transceiver front-end were designed.The main structure is that the transceiver branch is located on one HTCC substrate,and the other HTCC substrate is the local oscillator branch.The local oscillator branch uses a phase-locked loop to provide a local oscillator signal.The final,the button structure are vertically interconnected two modules to form a three-dimensional SIP structure;AGC circuit,phase-locked loop circuit,voltage regulator circuit which will be used in the transceiver front-end are processed,assembled and tested.Finally,the paper completes the processing,assembling,and testing of the front-end circuit,and analyzes the test results in detail.The test result analysis received the branch receiving frequency of 100 MHz ~ 3500 MHz,power-100 dBm ~ 0dBm,the output frequency is 140 MHz,the output power is greater than-2dBm,the small-signal noise figure is lower than 5dB,the spur suppression is greater than 20 d Bc;the emission branch output power more than 12 dBm,the entire circuit area is only 30 mm × 30 mm.