Research On Key Technologies Of Rf Microsystem Based On HTCC

With its excellent performance,active phased array radar is now widely used in fire control,target detection,electronic countermeasures in military field and weather warning,remote sensing detection and other operations in civil field.In active phased array radar systems,RF microsystem components,such as transceiver components and switch matrix components play an important role.The main research directions and difficulties of RF microsystem components are miniaturization,low cost and high integration,and System in Package(Si P)is the main solution for miniaturized microsystems at present.In thesis,two RF microsystem components are designed and processed by using High Temperature Co-fired Ceramic(HTCC)technology of Si P.The main work is as follows.First,thesis designed and packaged an X-band four-channel transceiver component by using HTCC substrate,the external interface form of the component is designed as QFN package,which can be directly connected with the antenna module through an LTCC adapter board,the overall size of HTCC substrate is 22×21×1.8mm~3.The measured effect of the transceiver component is:the saturation pulse transmit power of the transceiver component in the frequency band reaches 30.67d Bm;the phase shift error of the transceiver assembly is within±10°;the received state attenuation accuracy is within±1d B;the received gain is greater than 23d B;the received noise coefficients of channels1,2 and 3 are within 4.2d B,and the noise coefficient of channel 4 deteriorates to 7.5d B at 10GHz.Secondly,thesis uses reconfigurable scheme to design an 8×8 switching matrix,the reconfigurable unit is 4×4 switching matrix,and the 4×4 switching matrix supports arbitrary selection of 4 inputs to 4 outputs.The power division input PCB board and the switch output PCB board in the 8×8 switch matrix are designed.The power division input board supports input signal self-test and signal amplification,and the switch output board supports link self-test and signal amplification.A microcontroller chip is equipped on each board to output the switching control signal,and the microcontrollers communicate with each other through SPI.The 4×4 switch matrix is packaged with HTCC substrate,and the substrate size is48×37×2.9mm~3.In the power divider board and 4×4 switch matrix board,a two-way splitter and a four-way splitter are needed respectively,so thesis designs a four-way Wilkinson power divider and a two-way Wilkinson power divider to form eight-way splitter in the system.For the vertical transmission problem of 4×4 switch matrix board and power divider input board and switch output board,thesis proposes an RF pin vertical transmission structure with simple structure and low cost.The test results of 4×4 switching matrix show that in the frequency band of0.95?2GHz:(a)the overall return loss at the power division input of the component is better than 15d B,the return loss at the switching output is better than 13d B,and the insertion loss is less than 15d B;(b)the overall input and output isolation of the component is greater than 60d B;(c)the overall isolation of the switching output of the component is greater than 35d B;(d)the(d)the overall isolation of the adjacent channel is greater than 35dB.